Guest Editors
Austin Peng
ASML US LP – Silicon Valley
Dr. Austin Peng is a Senior Design Engineer at ASML Silicon Valley. Dr. Peng received his BS in Physics from Peking University in 2011 and PhD in Condensed Matter Physics from the University of California, Davis in 2016. In academia, Dr. Peng’s research topics have been dedicated to nano-scaled semiconductor physics. After joining ASML, Dr. Peng continues his research on advanced lithography techniques, with emphasis on extreme ultra-violet (EUV) optical imaging systems and computational lithography techniques. Being a young expert in photolithography, EUV optics, computational electromagnetism, and computational geometry, Dr. Peng holds 7 invention patents and authored 3 research papers on advanced lithography techniques. He is the inventor of many core algorithms in ASML’s computational lithography products.
Wen Lyu
ASML US LP – Silicon Valley
Dr. Wen Lyu is currently a Staff Engineer at ASML, Silicon Valley. He received his BS and PhD in Mechanical Engineering from Huazhong University of Science and Technology in 2011 and 2016 separately. His PhD research is on computational lithography to assist integrated circuit manufacture beyond optical limits, especially on fast and compact modeling of optical lithography and fast and manufacturable photomask optimization. After joining ASML in 2016, he continue work on this area and focus on various modeling techniques and products in computational lithography. He holds 3 invention patents and authored 13 research papers on advanced lithography techniques.
Collection Overview
Lithography has remained a cornerstone of modern science and technology, driving innovations in microfabrication, nanotechnology, electronics, photonics, and biomedical engineering. As the demand for miniaturization, precision, and scalability grows across diverse industries, lithographic techniques have evolved to meet these challenges with groundbreaking innovations such as extreme ultraviolet (EUV) lithography, nanoimprint lithography, and soft lithography. These advancements are enabling the creation of complex micro- and nanostructures with unprecedented resolution and functionality, opening new horizons for next-generation devices and applications.
Despite these strides, the field continues to face critical challenges, including pushing the limits of resolution and throughput, ensuring compatibility with emerging materials and substrates, and addressing the high costs of advanced systems. Equally important are the conceptual challenges of integrating lithography with complementary fabrication technologies and understanding the fundamental physical and chemical phenomena that govern these processes. Progress in this area requires not only innovative experimental approaches but also novel theoretical frameworks and applied research that bridge fundamental science with practical implementation.
This collection aims to showcase state-of-the-art methodologies, research findings, and reviews that highlight recent developments in lithographic technologies and their applications. By gathering contributions from leading researchers, this collection will serve as a comprehensive resource that illustrates both established and emerging strategies for advancing lithography.
The scientific community will benefit from this collection as it will provide access to detailed protocols and experimental techniques, cutting-edge research insights, and critical analyses that facilitate reproducibility, inspire novel applications, and support the translation of lithographic innovations into industrial and clinical settings.
