Threading Dislocations
Threading Dislocations - Related Videos
08:30
Intra-articular Shoulder Injection for Reduction Following Shoulder Dislocation
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2023
Source: Rachel Liu, BAO, MBBCh, Emergency Medicine, Yale School of Medicine, New Haven, Connecticut, USA The anterior shoulder dislocation is one of the most common joint dislocations seen in emergency settings. In anterior shoulder dislocation, the humeral head is displaced out of the glenohumeral joint in front of the scapular glenoid, resulting in a loss of the articulation between the arm and the rest of the shoulder. This can be caused by a fall onto an abducted, extended, and externally...
06:57
Theoretical Calculation and Experimental Verification for Dislocation Reduction in Germanium Epitaxial Layers with Semicylindrical Voids on Silicon
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Theoretical calculation and experimental verification are proposed for a reduction of threading dislocation (TD) density in germanium epitaxial layers with semicylindrical voids on silicon. Calculations based on the interaction of TDs and surface via image force, TD measurements, and transmission electron microscope observations of TDs are presented.
07:15
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Isolating electrical and thermal effects on electrically assisted deformation (EAD) is very difficult using macroscopic samples. Metallic sample micro- and nanostructures together with a custom test procedure have been developed to evaluate the impact of applied current on the formation without joule heating and evolution of dislocations on these samples.
09:42
Analysis of Thermal Expansion via Dilatometry
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Source: J. Jacob Chavez, Ryan T. Davis, and Taylor D. Sparks, Department of Materials Science and Engineering, The University of Utah, Salt Lake City, UT Thermal expansion is extremely important when considering which materials will be used in systems that experience fluctuations in temperature. A high or low thermal expansion in a material may or may not be desirable, depending on the application. For instance, in a common liquid thermometer, a material with a high thermal expansion would be...
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Bone Marrow Harvest from Mouse Hind Limb
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This video describes a detailed protocol to isolate fresh whole bone marrow from the mouse's hind limbs to investigate whole BM defects for patients with blood disorders such as leukemia.
FAQs
Applied stress can drive a threading dislocation through the crystal by glide or climb. These modes change the defect’s position relative to the surrounding atomic planes, allowing it to move away from its original location and influence how the lattice accommodates deformation. Their movement is therefore central to understanding changes in material strength and defect propagation.
Lattice mismatch between adjoining crystals, plastic deformation, and crystal growth can all introduce threading dislocations. In an epitaxial structure, a mismatch at the interface can create a defect that extends toward the surface as the film develops. These different origins matter because they connect processing history and interface design with the resulting defect density.
The Burgers vector specifies the magnitude and direction of the atomic misregistry associated with a dislocation. It provides a way to describe the defect’s geometric character rather than treating every lattice disturbance as equivalent. In engineering analysis, this information helps relate the defect structure to its movement through the crystal and to its potential effects on material behavior.
When threading dislocations propagate from an interface toward the surface, they can degrade optical and electronic performance in epitaxial thin films and semiconductor devices. Their presence links structural imperfections in the crystal to functional losses in the finished device. Controlling their propagation and density is therefore important when engineering coatings and microelectronic technologies that require reliable performance.
Characterizing threading dislocation density reveals how extensively these line defects occupy a crystalline material or device layer. That information supports decisions aimed at reducing defect populations and improving component quality. In practice, density serves as an important indicator when evaluating epitaxial films, semiconductor structures, coatings, and other engineered materials whose strength or functional performance depends on crystal quality.
They are especially important in epitaxial thin films, semiconductor devices, engineered coatings, and other crystalline components. In these settings, defects may extend from an interface toward a surface and affect strength, electrical behavior, optical performance, or overall reliability. Engineering efforts therefore focus on characterizing and reducing their density to support higher-quality materials and more dependable technologies.