Sputtering Chamber
Sputtering Chamber - Related Videos
12:20
Sputter Growth and Characterization of Metamagnetic B2-ordered FeRh Epilayers
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Cited by 23 •
2013
A method to prepare epitaxial layers of ordered alloys by sputtering is described. The B2-ordered FeRh compound is used as an example, as it displays a metamagnetic transition that depends sensitively on the degree of chemical order and the exact composition of the alloy.
04:22
Fabrication of Bi2Te3 and Sb2Te3 Thermoelectric Thin Films using Radio Frequency Magnetron Sputtering Technique
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Cited by 3 •
2024
The manuscript describes a protocol for radio frequency magnetron sputtering of Bi2Te3 and Sb2Te3 thermoelectric thin films on glass substrates, which represents a reliable deposition method that provides a wide range of applications with the potential for further development.
11:47
Characterization of Surface Modifications by White Light Interferometry: Applications in Ion Sputtering, Laser Ablation, and Tribology Experiments
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Cited by 13 •
2013
White light microscope interferometry is an optical, noncontact and quick method for measuring the topography of surfaces. It is shown how the method can be applied toward mechanical wear analysis, where wear scars on tribological test samples are analyzed; and in materials science to determine ion beam sputtering or laser ablation volumes and depths.
01:16
Chambers of the Heart
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2025
The human heart is a complex organ made up of four chambers: the right and left atria and the right and left ventricles. These internal chambers are separated by partitions known as the interatrial and interventricular septa. The exterior of the heart features a groove known as the coronary sulcus that demarcates the atria from the ventricles, while the anterior and posterior interventricular sulci distinguish between the two ventricles. Deoxygenated blood from the body is received in the right...
10:08
High-Resolution Respirometry in a Small-Volume Chamber
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Cited by 3 •
2025
Here, we show that the 0.5-mL chamber for high-resolution respirometry shows results that are consistent with the 2.0-mL chamber if appropriate instrumental O2 background correction is applied. It requires less sample, which is advantageous for studies with limited availability or low respiratory capacities.
FAQs
Chamber pressure helps determine the conditions under which the plasma operates and how ejected target atoms move before reaching the substrate. Changing pressure can therefore alter film structure and surface properties, rather than simply changing the deposition rate. Researchers adjust it alongside power, gas composition, substrate temperature, and deposition time to tailor the resulting coating.
Plasma power supplies the energy needed to sustain the energized gas, while the negatively biased target attracts positively charged ions. Ion impact transfers enough energy to eject atoms from the solid target. Adjusting these operating variables changes the conditions for material removal and helps researchers control the composition, thickness, and performance of the deposited film.
The introduced gas provides the environment in which the plasma forms, and its composition is one of the variables available for tuning the coating. Substrate temperature affects the conditions at the receiving surface during film formation. Together with pressure and power, these settings help researchers modify film structure and surface properties for a specific chemical or materials application.
Researchers first remove air from the chamber to establish a vacuum environment. They then introduce a low-pressure inert gas, typically argon, and energize it to create a plasma. With the target negatively biased, ions strike its surface and eject material. The released atoms travel to the substrate, where they condense into a thin coating.
Control comes from coordinating the target material with deposition time and the chamber settings. Pressure, power, gas composition, substrate temperature, and the duration of deposition can all be adjusted to tailor the film. This coordinated approach enables researchers to produce coatings with controlled composition and thickness instead of treating the deposited layer as a fixed outcome.
In chemistry, sputtered coatings can be designed for catalysis, sensors, electrodes, optical materials, and corrosion protection. Their controlled composition, thickness, and surface properties make the method useful when a material must perform at an interface or maintain a specific protective or functional surface. The chamber variables allow researchers to connect processing conditions with the desired coating performance.